Bsc Preferred T963292 Polyimide Silicone Tape 36 Per Case

Product Description

The BSC PREFERRED T963292 is a polyimide film tape with a silicone adhesive, engineered for use in high-temperature and demanding industrial environments. It combines electrical, thermal, chemical, and mechanical resistance into a single tape product capable of withstanding temperatures up to 500 degrees F. The silicone adhesive bonds securely without leaving residue on removal, which is critical in precision manufacturing and assembly work. Abrasion resistance and high dielectric strength make it suitable for electrical insulation and surface protection tasks. Each case contains 36 rolls. This tape is used by electronics assembly technicians, HVAC equipment manufacturers, automotive service professionals, and industrial maintenance trades.

The T963292 is suited for applications that require a tape to survive elevated heat, vibration, and chemical exposure without degrading. Common uses include insulating printed circuit boards, masking surfaces during high-temperature powder coating, wave soldering operations during circuit board assembly, semiconductor manufacturing processes, etching procedures, automotive sensor and manifold insulation, and fiber optics cable management. It is sold by the case in a quantity of 36 units.

Key Features

• Polyimide film construction with silicone adhesive for maximum thermal durability
• Maximum continuous service temperature of 500 degrees F
• High dielectric strength supports electrical insulation applications
• Silicone adhesive leaves no residue after removal
• Excellent abrasion resistance for demanding mechanical environments
• Withstands vibration, extreme temperatures, and chemical exposure

Compatibility

The T963292 is equivalent to part number S-17212. Designed as a general-purpose high-temperature polyimide tape for electronics assembly, industrial manufacturing, powder coating masking, and automotive applications where standard tapes cannot withstand thermal or mechanical stress.

Installation Notes

Apply to clean, dry surfaces free of oils, dust, and contaminants for best adhesion. When used in wave soldering or reflow oven applications, confirm that the surface temperature does not exceed the 500 degrees F rated maximum. Handling and application in semiconductor or PCB environments should follow applicable ESD and cleanroom protocols. Remove tape carefully after thermal exposure to avoid substrate damage, noting that the silicone adhesive is designed for clean removal.