Bsc Preferred BOB2020AS Anti-static Bubble Pouches 100/CS

Product Description

The BSC PREFERRED BOB2020AS is a case of 100 anti-static self-seal bubble pouches designed to protect static-sensitive components during storage and shipping. Each pouch is constructed with high-slip 3/16 inch bubble material and features a 1 inch lip with a built-in tape seal for quick, secure closure without additional tools or tape dispensers. The anti-static construction dissipates electrostatic charge, making these pouches appropriate for packaging circuit boards, capacitors, sensors, and other ESD-sensitive trade parts. Electricians, HVAC technicians, and electronics distributors commonly use these pouches when staging or shipping sensitive components.

These pouches are suited for light industrial and trade environments where ESD protection is required during transit or warehouse storage. The self-seal design speeds up the packing process on the bench or in the field, and the high-slip bubble surface reduces friction against component housings. Each case contains 100 pouches, making it practical for shops or supply houses that handle moderate to high volumes of sensitive parts regularly.

Key Features

• Anti-static bubble material protects ESD-sensitive components from electrostatic discharge
• Self-seal closure with 1 inch lip and integrated tape seal - no separate tape required
• High-slip 3/16 inch bubble construction reduces surface friction and abrasion
• 100 pouches per case for volume bench or warehouse use
• Equivalent to part number S-5182

Compatibility

Equivalent to part number S-5182. Designed as a general-purpose anti-static bubble pouch for packaging ESD-sensitive components across electrical, HVAC, and electronics supply applications.

Installation Notes

Insert components into the pouch with care to avoid puncturing the bubble layer. Press the self-seal lip firmly to ensure a secure closure before stacking or boxing pouches for shipment. No tools are required. Handle anti-static pouches away from open flame or heat sources that could compromise the film.