Bsc Preferred BOB1020AS Anti-static Bubble Pouches 200/case

Product Description

The BSC PREFERRED BOB1020AS is an anti-static self-seal bubble pouch designed to protect electrostatic discharge (ESD) sensitive components during storage and shipment. Each pouch is constructed with high-slip 3/16 inch bubble material and features a 1 inch lip with an integrated tape seal for a secure, tool-free closure. The anti-static properties make these pouches appropriate for packaging circuit boards, electronic assemblies, sensors, and other ESD-sensitive parts. Sold as a case of 200 pouches, this item is suitable for warehouse packing lines, service departments, and any operation that regularly ships or stores electronic components.

These pouches are used in light industrial, commercial, and field service environments where ESD-safe packaging is required. Typical applications include packing spare electronic control boards, motor drives, sensors, and similar components before transit or long-term storage. The self-seal design speeds up the packing process without the need for additional tape or heat sealing equipment. This product is equivalent to part number S-5281, offering a compatible replacement option for facilities already standardized on that specification.

Key Features

• Anti-static bubble construction protects ESD-sensitive components from electrostatic discharge
• 3/16 inch high-slip bubble provides cushioning against impact and vibration during shipment
• 1 inch lip with integrated tape seal allows fast, secure closure without additional tools or supplies
• Equivalent to part number S-5281 for cross-reference sourcing
• Sold in a case of 200 pouches for high-volume packing operations

Compatibility

Equivalent to part number S-5281. Suitable as an ESD-safe packaging solution for electronic components, control boards, and assemblies requiring anti-static bubble pouch protection.

Installation Notes

No tools or special equipment are required to use these pouches. Insert the component, press the tape seal firmly along the lip to close, and verify the seal is fully adhered before stacking or shipping. Follow applicable ESD handling procedures and any facility-specific packaging standards when packing sensitive electronic components.