3M 7000048445 Circuit Plating Tape 2in X 72yd 4.2 Mil Red

Product Description

The 3M 7000048445 is a circuit plating tape designed for electroplating masking applications in electrical and electronics manufacturing. The tape uses a red polyester film backing paired with a silicone adhesive that resists the harsh chemical baths, high temperatures, and mechanical stress typical of plating operations. At 4.2 mil total thickness, it provides a durable barrier that protects masked surfaces from plating solutions without leaving adhesive residue when removed. Each roll measures 2 inches wide by 72 yards long. Electricians, electronics technicians, and PCB fabricators working with selective plating processes are the primary installers of this product.

This tape is suited for use in printed circuit board manufacturing, connector plating, and precision masking where clean removal and chemical resistance are required. It performs in both manual masking setups and semi-automated production environments. The silicone adhesive maintains bond integrity through elevated process temperatures commonly encountered in electroplating and anodizing lines. The red color aids visual inspection during masking and removal steps.

Key Features

• Polyester film backing provides dimensional stability and chemical resistance during plating baths
• Silicone adhesive withstands elevated process temperatures without adhesive transfer
• 4.2 mil total thickness delivers a reliable masking barrier against plating solutions
• 2-inch width and 72-yard length suit both small-run and production-volume masking tasks
• Red color supports quick visual confirmation during masking and post-process removal
• Series Part Number 1280 for cross-reference with 3M product line documentation

Compatibility

Designed as an OEM-style masking solution for circuit plating and electroplating masking applications where a polyester film tape with silicone adhesive is specified.

Installation Notes

Apply to clean, dry surfaces free of oils, flux residue, or particulates before introducing the assembly into any plating or chemical bath. Ensure edges are firmly pressed down to prevent solution wicking under the tape during processing. Remove the tape promptly after plating is complete and before any post-process curing steps that could further bond the adhesive to the substrate. Personnel handling plating chemicals should follow applicable safety data sheet guidance and workplace chemical handling protocols.