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The 3M 7000029143 is a polyimide film tape combining a polyimide film backing with a silicone adhesive system. Sold as Tape 5413 in an amber finish, it measures 0.75 inches wide by 36 yards long with a total thickness of 2.7 mil. The silicone adhesive provides reliable bonding and clean removal across an operating temperature range of -100 degrees F to 500 degrees F (-73 degrees C to 260 degrees C). This tape is used by electronics assemblers, PCB fabricators, and industrial technicians who need a dependable high-temperature masking or release solution that holds up under soldering and curing processes.
This tape is designed for printed circuit board masking, specifically protecting gold fingers during wave solder or solder dip operations. It also serves as a release surface in parts fabrication where components are cured at elevated temperatures. Typical applications span electronics manufacturing, aerospace composites, and industrial fabrication environments where conventional tapes fail due to heat exposure. The amber polyimide film remains stable and dimensionally consistent throughout the soldering or curing cycle, making it a go-to choice for process engineers and assembly technicians.
Designed for use in wave solder and solder dip masking of printed circuit board gold fingers, and as a release surface in fabrication of parts cured at elevated temperatures.
Application is typically performed by electronics assemblers or PCB process technicians. Ensure the substrate surface is clean and dry before applying the tape to achieve full adhesive contact. Remove the tape promptly after the solder or curing process while the substrate is at a safe handling temperature to aid clean removal. Follow applicable IPC assembly standards and facility safety procedures when working near wave solder equipment or elevated-temperature curing ovens.
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