Weller T0051386099 Lead Free Solder Spool 500 G

Product Description

The WELLER T0051386099 is a lead-free solder supplied on a 500 g spool, formulated from a metal alloy designed for clean, reliable joints across a wide range of soldering applications. With a melting range of 422.6 degrees F to 429.8 degrees F and a wire diameter of 1.6 mm, this solder is suited for hand soldering irons, solder robots, and automated soldering equipment alike. Its lead-free composition supports compliance with RoHS and similar environmental standards commonly required in commercial and government work. Licensed electricians, electronics technicians, and specialized repair professionals will find this spool sized for production and field-repair use.

This solder is appropriate for electrical and electronic assembly, component repair, military, aerospace, automotive, solar, and medical device applications. The 500 g spool format reduces changeover frequency on bench stations and solder robots. It is suitable for both light residential repair work and demanding industrial or specialty applications where lead-free alloy formulations are specified or mandated by code or contract.

Key Features

• Lead-free alloy composition supports RoHS-compliant and environmentally regulated work environments
• Melting range of 422.6 degrees F to 429.8 degrees F provides a defined, predictable working window
• 1.6 mm wire diameter compatible with standard hand irons and automated solder robot feeders
• 500 g spool size reduces material handling interruptions during production runs
• Suitable for electrical, electronic, military, aerospace, automotive, solar, and medical device applications

Compatibility

Designed for use with standard soldering irons, soldering stations, and solder robot systems that accept 1.6 mm diameter solder wire on a spool format.

Installation Notes

Soldering should be performed by qualified technicians following applicable electrical and electronics assembly standards. Ensure adequate ventilation when soldering, as flux fumes are generated even with lead-free alloys. Allow joints to cool undisturbed before handling to ensure proper bond formation. Consult applicable IPC or military soldering standards for joint quality requirements on regulated work.