Value Collection 1323963OAP30201 Water Soluble Solder

Product Description

The VALUE COLLECTION 1323963OAP30201 is a water soluble solder in an Alloy 63/37 tin-lead formulation, supplied as a 1-pound spool in 25 gauge wire with a 66 core flux configuration. The 63/37 eutectic ratio means the alloy transitions directly from liquid to solid without a plastic phase, producing cleaner, faster joints compared to non-eutectic formulations. The water soluble flux core is designed to be fully removed with deionized or tap water after soldering, leaving a residue-free surface suitable for inspection and conformal coating. This solder is used by electronics technicians, PCB assemblers, and electrical tradespeople who require post-solder cleaning as part of their process or quality standard.

This solder is suited for through-hole and surface-mount assembly work where flux residue cannot be left in place. Water soluble flux is particularly common in industrial electronics assembly, control board repair, and production environments that already include an aqueous wash step. The 25 gauge diameter makes it appropriate for fine-pitch work and smaller solder joints typical in low-voltage control circuits, terminal connections, and sensor wiring found in HVAC controls, electrical panels, and similar trade applications.

Key Features

• Eutectic 63/37 tin-lead alloy for sharp, fast-solidifying joints with no plastic phase
• Water soluble flux core eliminates need for solvent-based cleaning
• 25 gauge wire suitable for fine-pitch and small-joint applications
• 66 core flux designation for consistent flux distribution along the wire
• 1-pound spool provides substantial working quantity for shop or field use

Compatibility

Designed as a general-purpose water soluble solder suitable for electronic assembly, control board repair, and low-voltage electrical connection work where post-solder aqueous cleaning is performed.

Installation Notes

Water soluble flux residue is corrosive if left in place and must be cleaned from the joint surface promptly after soldering using deionized or clean tap water. Power down and de-energize all circuits before soldering any live control board or electrical assembly. Use appropriate soldering iron tip temperatures for the alloy and joint mass; avoid overheating small pads or conductors. Disposal of flux-contaminated rinse water should comply with local environmental regulations.