Panduit CJK688TGBU Mini-com Keyed Module Cat 6

Product Description

The PANDUIT CJK688TGBU is a Mini-Com keyed modular jack insert rated for Category 6 structured cabling applications. This keystone-style module is designed to snap into Mini-Com faceplates, surface-mount boxes, and patch panels, providing a secure and organized termination point for horizontal copper cabling runs. The keyed design helps prevent incorrect module insertion, supporting consistent port identification in high-density installations. It is installed by low-voltage cabling technicians and data communications contractors in both new construction and retrofit network infrastructure projects.

This module is suited for commercial and residential structured wiring deployments where Cat 6 performance is required. Typical installations include office workstation drops, telecommunications rooms, data centers, and other environments that demand organized, standards-compliant network cabling infrastructure. The Mini-Com form factor is a common platform used in modular outlet assemblies, allowing field technicians to populate faceplates with the appropriate insert types for each location.

Key Features

• Category 6 rated for high-speed copper network cabling performance
• Keyed module design reduces risk of incorrect port insertion in dense panel environments
• Snap-in Mini-Com form factor compatible with Mini-Com faceplates, patch panels, and surface-mount boxes
• Sold individually, allowing flexible installation quantities per project

Compatibility

Designed as an OEM-style replacement or field-install module for use with PANDUIT Mini-Com series faceplates, patch panels, and surface-mount boxes that accept standard Mini-Com keystone inserts.

Installation Notes

Installation is performed by licensed low-voltage cabling technicians following TIA-568 structured cabling standards. Terminate and test all cabling before final module seating in the faceplate or panel. Avoid bending cable beyond its minimum bend radius at the termination point. Verify faceplate or panel compatibility with the Mini-Com module form factor before installation.