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The LID CORPORATION Eastman Tetrashield MP2304 is a protective resin meant for metal packaging. This product enhances the effectiveness of Bisphenol A non-intent (BPA-NI) metal packaging coatings. Its high solids content enables the creation of coatings with a greater concentration of solids, ensuring improved quality and performance. In addition, this resin provides chemical resistance, which safeguards the packaged contents. The Tetrashield MP2304 works well with gold phenolic coatings, promoting formulation versatility. It is suitable for use in ends, caps, closures, and general line applications, helping to enhance coating function.
This product ensures improved performance for metal packaging.
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