Lenovo 02DM003 THERMAL SWG THM ASSY TOSHIBA

Product Description

The Lenovo 02DM003 thermal SWG THM assembly is designed for use with Toshiba systems. This assembly plays a crucial role in maintaining optimal thermal performance by effectively dissipating heat. It is a necessary component for ensuring reliable operation in compatible devices.

• Designed for Toshiba systems
• Maintains optimal thermal performance
• Essential for reliable device operation

Product Highlights

A reliable thermal assembly for Toshiba, ensuring devices operate within safe temperature ranges.

Product Information

Standard Information

• Brand: Lenovo
• MPN: 02DM003

Technical Specifications

• Weight: 1.035 pounds
• Length: 12 inches
• Width: 4 inches
• Height: 19 inches
• Hazmat: N
• Oversized: N