Kester 300103 TSF-6502 No-Clean Soldering Flux 30g Syringe ROL1

Product Description

The Kester TSF-6502 is a no-clean soldering flux that comes in a thirty-gram syringe. This flux is designed for soldering on nickel surfaces and features a high level of activity. It effectively wets OSP treated copper and oxidized copper surfaces, ensuring reliable solder joints even after multiple thermal cycles.

Post reflow, the product leaves clear residues that do not require cleaning. The TSF-6502 is suitable for a variety of temperature and humidity conditions, making it versatile for different work environments.

• High activity level for effective soldering on nickel surfaces
• Leaves clear residues after soldering
• Suitable for various temperature and humidity conditions

Product Highlights

The Kester TSF-6502 is used widely in electronic assembly due to its effective performance on complex surfaces.

Product Information

Standard Information

• Brand: Kester Solder
• MPN: 300103

Technical Specifications

• Flux Type: No-Clean
• Container Type: Syringe
• Container Size: 30g
• Shelf Life: 6 Months
• Storage Temperature: 0 to 10 °C
• Chemical Composition: Rosin, Glycol Ether, Propylene Glycol Compound, N-Methyl-2-Pyrrolidone
• Temperature Rating: 150 to 210 °C
• Odor/Scent: Mild