Harris 331753 50/50 Lead Solder 1/8 inches X1 Lb Spl

Product Description

The HARRIS 331753 50/50 Lead Solder is a solid wire, formulated for joining copper, copper alloys, and ferrous-based alloys. It is suitable for general-purpose soldering, radiator repairs, sheet metal work and other non-electrical applications. This leaded solder has a lower melting point and better wettability than lead-free solders.

• Can be used to solder copper and most copper alloys, lead, nickel alloys, and steel with some exceptions
• Used primarily for general purpose soldering applications including sheet metal work
• Heat sources include soldering guns, irons and air-fuel torches

Product Highlights

This 50/50 solder flows faster due to its narrow melting range and improves conductivity between metals. Meets ASTM B-32 specifications.

Product Information

Standard Information

• Brand: HARRIS
• Manufacturer Part Number: 331753
• Country of Origin: United States

Technical Specifications

• MPN: 331753
• Brand: HARRIS
• Form: Solid Wire
• Weight: 1 lb
• Contents: 50% Lead, 50% Tin
• Diameter: 1/8 in
• Standards: ASTM B-32
• Application: Sheet Metal Work; Welding
• Composition: 50% Tin, 50% Lead
• For Joining: Copper, Lead, Steel Alloy
• Solder Series: 50/50
• Wire Diameter: 0.125 in
• Container Size: 1 lb
• Container Type: Spool
• Package Quantity: 1.0
• Solder Composition: Tin-Lead
• Material Composition: 50% Tin, 50% Lead
• Melting Temperature (Minimum): 360 Degrees F
• Melting Temperature (Maximum): 421 Degrees F
• Country of Origin: United States
• ASTM B32 Alloy Grade: Sn 50
• J-STD-006: Sn50Pb50Sb0.4
• Applications: Tin-lead solder, with some exceptions, can be used to join copper and most copper alloys, lead, nickel alloys and steel
• Heat sources: soldering guns, irons, and air-fuel torches
• Melting Temperature: 421 deg F Liquid, 361 deg F Solid
• Net Content: 1 lb
• Minimum Soldering Temperature: 360 °F
• Maximum Soldering Temperature: 421 °F
• Series: 50/50
• Alloy: 50/50