Devcon 14415 2-part Epoxy Structural Adhesive 400ml

Product Description

The DEVCON 14415 is a two-part, room-temperature-cure epoxy adhesive designed for high-performance structural bonding applications. Part of the HP 250 Series, this amber-colored paste adhesive delivers exceptional chemical resistance and mechanical durability once fully cured. It mixes at a 2:1 ratio and reaches full cure in 7 days at room temperature. With a viscosity of 105,000 cP and a Shore D hardness of 78, the cured bond resists deformation under load. A dielectric strength of 490 V/Mil makes it suitable for applications where electrical isolation is a factor. The 400 mL cartridge format supports metered dispensing for consistent mix ratios on production or field service work.

The DEVCON 14415 is suited for structural bonding across metal, composite, and multi-surface assemblies in industrial, mechanical, and facility maintenance settings. Its paste viscosity prevents sagging on vertical surfaces, and its wide service temperature range of -67 to 250 degrees F makes it appropriate for components that see both cold and elevated heat in service. Maintenance technicians, industrial assemblers, and trade professionals working with structural joints, brackets, or bonded assemblies will find this adhesive applicable to both shop and field repairs.

Key Features

• HP 250 Series two-part epoxy with 2:1 mix ratio for consistent, repeatable results
• Very high viscosity paste (105,000 cP) — no sag on vertical or overhead surfaces
• Shore D hardness of 78 for a rigid, load-bearing cured bond
• Dielectric strength of 490 V/Mil supports use in electrical isolation applications
• Service temperature range of -67 to 250 degrees F for demanding environments
• 400 mL cartridge format compatible with standard dual-cartridge dispensing guns
• Shelf life of 1,125 days from date of manufacture

Compatibility

Designed as a multi-surface structural adhesive suitable for bonding metals, composites, plastics, and similar substrates in room-temperature structural bonding applications.

Installation Notes

Surface preparation is critical — clean and abrade bonding surfaces before application to ensure proper adhesion. Use a dual-cartridge dispensing gun matched to the 400 mL, 2:1 cartridge format along with the appropriate static mixing nozzle. Purge a small amount of adhesive before beginning application to confirm both components are dispensing evenly. Allow the full 7-day room-temperature cure before subjecting the bond to structural loads.

Technical Specifications

• Product Type: 2-Part Epoxy
• Series: HP 250
• Adhesive Type: Multi-surface
• Color: Amber
• Physical Form: Viscous Liquid / Paste
• Mix Ratio: 2:1
• Viscosity: 105,000 cP
• Cure Type: Room Temperature Cure
• Cure Time: 7 days
• Hardness: 78 Shore D
• Dielectric Strength: 490 V/Mil
• Temperature Range: -67 to 250 degrees F
• Specific Gravity: 0.99
• Container Size: 400 mL
• Container Type: Cartridge
• Shelf Life: 1,125 days
• Odor: Ammonia-like

Standard Information

• Brand: DEVCON
• Manufacturer Part Number: 14415