Product Description
Devcon 14278 offers a robust solution for bonding a variety of materials. This 25 Epoxy Plus Adhesive, available in a 50 mL Dev-Pak, is designed for superior adhesion to metals, fiber-reinforced plastic composites, rigid plastics, concrete, glass, and wood. Its light gray formulation provides a versatile match for many surfaces.
- 25-minute working time allows for adjustments and positioning
- Non-corrosive formula ensures longevity and material safety
- Developed for multi-purpose applications across a broad range of materials
Product Highlights
This epoxy adhesive is not just another adhesive; it offers a 550 V/mil dielectric strength and a hardness of 74 Shore D, making it a go-to choice for professionals seeking reliability and durability in their bonding applications. With a full cure time of 24 hours at 75 degrees Fahrenheit, it promises a strong bond to withstand various environmental conditions.
Product Information
Standard Information
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MPN: 14278
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Country of Origin: US
Technical Specifications
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Weight: 0.09 lb
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Volume: 50 mL
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Length: 4.6 inches
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Width: 2.75 inches
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Height: 1.1 inches
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Viscosity: 50,000 cP at 77.0 degrees Fahrenheit
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Temperature Range: -40 to 200 degrees Fahrenheit
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Full Cure Time: 24 h at 75 degrees Fahrenheit
