Bsc Preferred T969987 Adhesive Transfer Tape 1.7 Mil 72 Per Case

Product Description

The BSC PREFERRED T969987 is an economy pressure-sensitive adhesive transfer tape designed for fast, finger-touch application in light industrial and general trade use. The medium-firm acrylic adhesive system delivers a strong balance of high initial tack and reliable shear holding power. At 1.7 Mil thickness, the adhesive bonds instantly on contact, making it well suited for high-volume assembly or fabrication tasks where speed matters. The tape ships on a 1 inch core with a tan paper liner and is reverse-wound for consistent dispensing. Each case contains 72 rolls.

This transfer tape is used wherever a thin, aggressive adhesive bond is needed without the bulk of a conventional double-coated tape. Typical applications include bonding papers, metallic foils, flexible films, and lightweight foams in manufacturing, packaging, signage, and general fabrication environments. It is compatible with standard tape dispensers and is sold by the case to support ongoing production or service needs. Installers and fabricators in light industrial settings find it effective for both permanent and semi-permanent bonds on smooth, clean surfaces.

Key Features

• 1.7 Mil acrylic adhesive thickness bonds instantly on contact with finger-touch pressure
• Medium-firm adhesive system balances high initial tack with good shear holding power
• Reverse-wound on a 1 inch core for consistent feed and dispenser compatibility
• Tan paper liner protects the adhesive layer during storage and handling
• Suitable for bonding papers, foils, flexible films, and various foam substrates
• Sold 72 rolls per case for volume supply

Compatibility

Designed for use with standard 1 inch core tape dispensers. Equivalent to part number S-14463. Suitable for bonding papers, foils, films, and foams in general fabrication and assembly applications.

Installation Notes

Surface preparation is critical for pressure-sensitive adhesives. Clean and dry all substrate surfaces before application to ensure maximum bond strength. Apply firm finger pressure across the bonded area to activate full adhesive contact. Once bonded to porous or absorbent substrates, removal may damage the material surface.