Bsc Preferred T964293 Polyimide Masking Disc Roll 500ct

Product Description

The BSC PREFERRED T964293 is a polyimide film masking disc with a silicone adhesive backing, designed for precision masking of small areas during high-temperature manufacturing processes. Each disc is supplied on a liner wound on a 3-inch core. The silicone adhesive is engineered to withstand temperatures up to 500 degrees F without leaving adhesive residue upon removal. This product is used in electronics assembly, industrial coating, and manufacturing environments where clean, reliable masking is required at elevated temperatures. Sold in cases of 500 discs per roll, it is a direct equivalent to part number S-17223.

This masking disc is suited for wave soldering operations on printed circuit boards, where reliable adhesion and clean removal after thermal exposure are critical. It also performs in powder coating lines, automotive manufacturing, and transformer production where masking must survive high-process temperatures without lifting, migrating, or leaving contamination behind. The polyimide film substrate maintains dimensional stability under heat, making it appropriate for automated and hand-masking workflows in both production and rework environments.

Key Features

• Polyimide film construction withstands temperatures up to 500 degrees F
• Silicone adhesive leaves no residue after removal
• Discs supplied on a liner wound on a 3-inch core for easy dispensing
• Equivalent replacement for part number S-17223
• Sold in 500-count cases for production-volume use
• Suitable for wave soldering, powder coating, and transformer manufacturing masking

Compatibility

Designed as an equivalent replacement for part number S-17223. Suitable for use in circuit board masking, powder coating, automotive manufacturing, and transformer manufacturing applications requiring high-temperature-rated adhesive masking discs.

Installation Notes

Apply discs to clean, dry surfaces prior to the masking process to ensure proper adhesion and seal. Remove discs promptly after the process cycle is complete to simplify removal and prevent adhesive interaction with substrates over extended periods. Use in accordance with facility safety protocols when working near wave solder equipment or powder coating ovens. No special tools are required for application or removal.