Bsc Preferred T9114026 Foam Mounting Tape 1000 Per Case

Product Description

The BSC PREFERRED T9114026 is an open cell polyurethane foam tape with a firm acrylic adhesive backing, designed for bonding, gap-filling, and stress distribution across irregular surfaces. The foam carrier measures 1/16 inch thick and conforms to uneven substrates, allowing the adhesive to make consistent contact across the bonded area. The acrylic adhesive delivers high bond strength along with resistance to elevated temperatures and solvents. This tape is well-suited for trade professionals working in HVAC, plumbing, electrical, and general building construction who need a reliable, conformable bonding solution for panel assembly, equipment mounting, or surface sealing tasks.

This tape is intended for indoor applications and for exterior installations where the tape itself will be shielded from direct environmental exposure. The ideal application temperature range is 70 degrees F to 100 degrees F. It distributes stress uniformly across bonded areas rather than concentrating load at fastener points, making it appropriate for bonding components with irregular or slightly flexible mating surfaces. This product is equivalent to part number S-10062 and is sold in a case quantity of 1000 pieces.

Key Features

• 1/16 inch open cell polyurethane foam carrier conforms to irregular surfaces
• Firm acrylic adhesive provides high bond strength and solvent resistance
• High temperature resistance suitable for demanding install environments
• Distributes stress uniformly over bonded areas to reduce point-load failure
• Fills gaps between mating surfaces for a secure, consistent bond
• Suitable for indoor use and protected exterior applications

Compatibility

Designed as a general-purpose foam mounting tape for indoor and protected exterior applications across HVAC, electrical, plumbing, and building construction trades. Equivalent to part number S-10062.

Installation Notes

Clean and dry both mating surfaces thoroughly before application to ensure full adhesive contact. Apply within the recommended temperature range of 70 degrees F to 100 degrees F for optimal bond formation. No special tools are required, but firm hand pressure across the full bonded area is recommended at time of application. Allow adequate dwell time before placing the assembly under load.