Bsc Preferred DS2010 Anti-static Moisture Barrier Bags 100pk

Product Description

The BSC PREFERRED DS2010 is a multi-layer anti-static moisture barrier bag designed to protect sensitive electronic components from electrostatic discharge, moisture ingress, and puncture damage during storage and shipping. The bag construction combines puncture-resistant layers with static-shielding properties to guard against charge buildup that can damage or degrade electronic assemblies. These bags are heat sealable and rated for vacuum packaging applications, making them suitable for high-volume packaging operations where a reliable hermetic seal and ESD protection are both required. Licensed electricians, electronics assembly technicians, and warehouse packaging personnel are the primary users.

The DS2010 bags are intended for commercial packaging of printed circuit boards, semiconductors, sensors, capacitors, and other static-sensitive components. They are well suited for environments where components are staged for long-term storage or transit and must be protected from humidity and static discharge. Sold in a case quantity of 100 bags, they are appropriate for ongoing production or service depot operations. This product is intended for commercial use only and is not listed on the Qualified Product Listing under the Defense Standardization Program.

Key Features

• Multi-layer construction provides puncture resistance and electrostatic discharge protection
• Moisture barrier design shields contents from humidity and condensation
• Heat sealable for secure, repeatable closure in production environments
• Compatible with vacuum packaging equipment and processes
• Sold in a case quantity of 100 bags for high-volume use

Compatibility

Designed as a commercial-grade anti-static moisture barrier bag for packaging and storing static-sensitive electronic components and assemblies.

Installation Notes

Bags should be sealed using a heat sealer calibrated to the bag material thickness to ensure a consistent, airtight closure. Before inserting components, verify that work surfaces and handling tools are properly grounded to avoid pre-packaging ESD exposure. For vacuum packaging, use equipment appropriate for multi-layer film materials. Follow applicable ESD control standards and facility protocols when handling sensitive electronic components.