Bsc Preferred BOB711AS Anti-static Bubble Pouches 400/case

Product Description

The BSC PREFERRED BOB711AS is an anti-static self-seal bubble pouch designed to protect static-sensitive components during storage and shipping. Each pouch features a 1 inch lip with a tape seal closure and is constructed with high-slip 3/16 inch bubble material. The anti-static formulation dissipates electrostatic charge, reducing the risk of damage to sensitive electronic parts and assemblies. This case pack is a practical solution for warehouse operations, electronics distributors, and field service teams that need reliable, ready-to-use protective packaging without cutting or sealing equipment.

These pouches are suited for packaging printed circuit boards, electronic modules, sensors, and other static-sensitive components prior to shipment or bench storage. The self-seal design speeds up packing workflows in high-volume environments. Sold in a case quantity of 400 pouches, the BOB711AS is well-matched for operations that cycle through protective packaging regularly and need consistent supply on hand. This product is equivalent to part number S-2871.

Key Features

• Anti-static bubble material protects static-sensitive electronics from electrostatic discharge
• Self-seal closure with 1 inch lip and tape seal - no heat sealer required
• High-slip 3/16 inch bubble construction for cushioned protection
• Case quantity of 400 pouches for high-volume packing operations
• Equivalent replacement for part number S-2871

Compatibility

Designed as a general-purpose anti-static protective pouch for static-sensitive electronic components and assemblies requiring cushioned, electrostatic-discharge-safe packaging. Equivalent to part number S-2871.

Installation Notes

No tools or special equipment are required to use these pouches. Insert the component, press the tape seal firmly to close. Store unused pouches in a cool, dry location away from direct sunlight to preserve seal integrity and anti-static properties. Follow applicable ESD handling procedures when packaging sensitive components.