3M 7100063956 Thermally Conductive Adhesive Transfer Tape

Product Description

The 3M 7100063956 is a pressure-sensitive thermally conductive adhesive transfer tape used to create a reliable heat-transfer path between heat-generating components and cooling hardware. Loaded with thermally conductive ceramic fillers, the tape bonds to substrates under pressure alone — no heat cure cycle required. The adhesive is modestly soft, which allows it to conform to non-flat and irregular surfaces, providing strong adhesion and good surface wetting. This combination of thermal conductivity and electrical insulation makes it a practical interface material for electronics assembly, thermal management applications, and component-level heat dissipation work.

This tape is suited for applications where heat-generating electronic components must be bonded or coupled to heat sinks, heat spreaders, heat pipes, or cooling fans. The pressure-sensitive design simplifies assembly in production and field-service environments. It is commonly used in electronics manufacturing, industrial controls, power electronics, and any application requiring a thin, conformable thermal interface material. The roll format — 22 inches wide by 36 yards long — supports both high-volume fabrication and custom die-cut workflows.

Key Features

• Bonds under pressure only — no heat cure cycle required
• Ceramic-loaded adhesive provides both thermal conductivity and electrical insulation
• Soft, conformable formulation wets and adheres to non-flat substrates
• Provides a preferential heat-transfer path between components and heat sinks or cooling devices
• Roll format supports high-volume or custom-cut assembly applications

Compatibility

Designed as a thermal interface adhesive for use with heat sinks, heat spreaders, heat pipes, and cooling fans across a wide range of heat-generating electronic and industrial components.

Installation Notes

Installation is performed by trained electronics assemblers or technicians working with thermal management systems. Power down and de-energize all equipment before applying or replacing thermal interface materials. Surface preparation — including cleaning and drying the substrate — is essential for maximum bond strength and thermal performance. Follow applicable IPC standards and equipment manufacturer guidelines for thermal interface installation procedures.