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The 3M 7100059628 is a pressure-sensitive thermally conductive adhesive transfer tape designed to create a reliable thermal interface between heat-generating components and cooling devices such as heat sinks, fans, heat spreaders, and heat pipes. Loaded with thermally conductive ceramic fillers, it bonds without a heat cure cycle — pressure alone is sufficient to form a strong bond and effective thermal interface. The adhesive is modestly soft, allowing it to conform to non-flat substrates while maintaining high adhesion and good electrical insulation. This tape is suited for electronics assembly and thermal management applications where both conductivity and bonding strength are required.
This tape is used in applications where a preferential heat-transfer path must be established between components. Typical use cases include bonding heat sinks to processors, power transistors, LED modules, or other heat-generating electronic assemblies. The adhesive wets well to a wide range of substrate surfaces, making it adaptable to varied materials encountered in electronics manufacturing and field service work. It provides both thermal conductivity and electrical insulation in a single layer, eliminating the need for separate interface materials in many configurations.
Designed as a thermally conductive adhesive transfer tape for use with a broad range of substrates in electronics thermal management applications where pressure-sensitive bonding and thermal interface performance are required.
Surface preparation is critical — substrates should be clean, dry, and free of oils or contaminants before application. Apply firm, even pressure across the tape surface to activate the adhesive bond. Power down and de-energize any electronic assembly before applying or repositioning thermal interface materials. Avoid stretching the tape during application, as this may affect bond integrity and thermal performance.
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