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The 3M 7100031985 is a high-temperature-resistant, fast-setting hot melt adhesive formulated for bonding low surface energy (LSE) substrates. Sold as a 22-pound box of off-white chips with a plastic liner, this thermoplastic adhesive is designed for use in hot melt dispensing equipment. It delivers strong peel strength even on difficult-to-bond plastics such as polyethylene and polypropylene. The fast-setting open time makes it well suited for production environments where throughput and bond reliability are priorities. Fabricators, assembly technicians, and industrial maintenance professionals working with plastic substrates are the primary users of this adhesive.
This adhesive is used across transportation, point-of-purchase display, signage, and packaging applications where materials must maintain bond integrity under elevated temperatures. It performs on a wide range of plastic substrates that are typically resistant to standard adhesives, making it a practical choice when assembling or repairing components in commercial and industrial settings. Its chip form factor allows it to be loaded directly into compatible hot melt applicators and dispensing systems.
Designed for use with hot melt dispensing applicators compatible with chip-form thermoplastic adhesives. Bonds polyethylene, polypropylene, and many other plastics commonly used in transportation, point-of-purchase display, signage, and packaging applications.
This adhesive is applied using compatible hot melt dispensing equipment set to the appropriate processing temperature for the 3731 B formulation — consult the 3M applicator guide for dispensing options. Allow equipment to reach full operating temperature before dispensing to ensure consistent flow and bond quality. Keep chips dry and stored in a sealed container when not in use to prevent moisture absorption. Handle dispensing equipment with appropriate personal protective equipment, as molten adhesive can cause burns.
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