3M 7100010220 Thermal Bonding Film AF42 20in X 72yd 3 Mil

Product Description

The 3M 7100010220 is an unsupported, thermosetting film adhesive engineered for structural bonding of metals and glass. At 3 mil thickness and 20 inches wide on a 72-yard roll, this adhesive film delivers high shear, peel, and cleavage strength across a broad temperature range. It can be cured in as little as 30 seconds at 450 degrees F, making it well suited for applications where fast cycle times matter. The film is lightweight, easy to handle, and maintains high clarity when in contact with a solid surface, which is critical for glass bonding work where aesthetics matter.

This adhesive film is used in industrial and specialty fabrication applications involving metal-to-metal, metal-to-glass, or glass-to-glass structural bonding. Its low tack and low flow characteristics allow for precise placement and repositioning before cure. Relatively low bonding pressures are sufficient to achieve a tough, flexible bond, making it practical for a range of lamination and assembly scenarios where heat press or heated platen equipment is available.

Key Features

• Thermosetting, unsupported film adhesive — cures to a tough, flexible structural bond
• Fast cure: as little as 30 seconds at 450 degrees F
• High shear, peel, and cleavage strengths over a wide temperature range
• High film clarity when bonded to solid surfaces — suitable for glass applications
• Low tack and low flow for precise, controlled placement before cure
• Lightweight and easy to handle; requires only relatively low bonding pressures

Compatibility

Designed for the structural bonding of metals and glass surfaces. Best suited for applications where a clear, flexible, heat-cured film adhesive is required.

Installation Notes

Application should be performed by personnel familiar with heat-cure adhesive film processes and appropriate press or lamination equipment. Ensure bonding surfaces are clean, dry, and free of oils or contaminants before applying the film. Follow established cure temperature and pressure parameters for the specific substrate combination. Handle uncured film with care to avoid contamination that could compromise bond integrity.