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The 3M 7010374057 is a pressure-sensitive, thermally conductive adhesive transfer tape designed to create reliable thermal interface bonds without a heat cure cycle. Loaded with ceramic fillers, it forms a preferential heat-transfer path between heat-generating components and cooling devices such as heat sinks, fans, heat spreaders, and heat pipes. No curing equipment is required — pressure alone activates the bond, making it a practical solution for thermal management assembly work in electronics, industrial, and OEM manufacturing environments. The tape ships in roll form measuring 2 inches wide by 10 yards long.
This tape is suited for applications where consistent thermal conductivity and strong adhesion to varied substrates are required. Typical use cases include bonding power semiconductors, LED assemblies, and circuit boards to heat sinks or spreaders. It is commonly specified in electronics manufacturing, field service repair, and thermal management assembly work where eliminating a cure oven from the process reduces cycle time and equipment cost.
Designed as a thermally conductive interface material for bonding heat-generating components to heat sinks, heat spreaders, fans, and heat pipes across a wide range of substrates in electronics and industrial assembly applications.
Surface preparation is critical — clean and dry both mating surfaces before application to ensure full adhesive contact and optimal thermal performance. Cut tape to the required geometry, position carefully, and apply firm, even pressure across the entire bonded area to activate the adhesive. No curing oven or elevated temperature is needed. Follow applicable workplace safety practices and the component manufacturer guidelines when working with heat-sensitive assemblies.
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