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The 3M 7010374051 is a pressure-sensitive adhesive transfer tape loaded with thermally conductive ceramic fillers, designed to create a reliable heat-transfer path between heat-generating components and cooling devices such as heat sinks, fans, heat spreaders, and heat pipes. No heat cure cycle is required — bond formation relies on pressure alone. The tape is modestly soft, allowing it to conform to non-flat substrates, wet irregular surfaces, and maintain high adhesion across a wide range of materials. It provides both good thermal conductivity and electrical insulation, making it suitable for thermal interface management in electronic and electrical assemblies.
This tape is used in applications where a low-profile, bondable thermal interface material is needed between heat-generating components and passive or active cooling solutions. Typical installation scenarios include attaching heat sinks to circuit boards, securing heat spreaders in power electronics, and bonding thermal management components in HVAC control modules, drives, and similar assemblies. The 4-inch width and 36-yard roll length make it practical for production-volume use as well as field repair work. Sold in rolls and available with a minimum order quantity of 2 rolls.
Designed as a thermally conductive adhesive interface for use between heat-generating components and heat sinks, fans, heat spreaders, or heat pipes across a broad range of electronic, electrical, and thermal management assemblies.
Installation is performed by applying pressure to the tape once it is positioned between the mating surfaces — no curing equipment is needed. Surfaces should be clean, dry, and free of oils or contaminants before application to ensure full adhesion and thermal contact. Electricians and electronics technicians installing this tape in energized assemblies should de-energize and discharge the equipment before handling internal components. Follow applicable electrical codes and equipment manufacturer guidelines when integrating thermal interface materials into control boards or power electronics.
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