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The 3M 7010374049 is a pressure-sensitive thermally conductive adhesive transfer tape designed to create a reliable heat-transfer path between heat-generating components and cooling devices such as heat sinks, fans, heat spreaders, and heat pipes. The adhesive is loaded with thermally conductive ceramic fillers and requires no heat cure cycle to bond. It is modestly soft, allowing it to conform to non-flat surfaces and wet effectively to a wide variety of substrates. The result is high adhesion, good thermal conductivity, and electrical insulation in a single interface material. Installation requires pressure only.
This tape is used in electronics assembly, thermal management applications, and equipment manufacturing where a dependable thermal interface between components and cooling hardware is required. It is well suited for bonding heat sinks to circuit boards, attaching heat spreaders to processors or power modules, and securing heat pipes to conductive surfaces. The roll format at 7 inches x 36 yards supports both production-line cutting and bench-top fabrication. Typical installers include electronics technicians, electromechanical assemblers, and industrial maintenance professionals working with thermal management systems.
Designed as a thermal interface adhesive transfer tape for use between heat-generating electronic components and cooling devices including heat sinks, heat spreaders, fans, and heat pipes across a wide range of substrate types.
Installation is performed by electronics technicians or electromechanical assemblers following applicable ESD and component-handling protocols. Power down and de-energize all equipment before applying the tape to heat-generating components. Clean and dry both substrate surfaces thoroughly before application to ensure maximum adhesion. Apply firm, even pressure across the bonded area to activate the pressure-sensitive adhesive and form the thermal interface.
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