3M 7010373981 Electrically Conductive Tape 0.5in X 36yd 3mil

Product Description

The 3M 7010373981 is an XYZ-axis electrically conductive pressure-sensitive tape designed for EMI and RFI shielding in demanding electronic applications. It uses an acrylic adhesive system and comes on a 58-pound polycoated kraft paper liner. The tape measures 0.5 inches wide by 36 yards long with a 3.0 mil total thickness and a 4.0 mil liner. It is rated for medium temperature service and offers high solvent resistance. The adhesive provides high surface energy (HSE) bonding capability along with performance on low surface energy (LSE) substrates, making it suited for a range of electronic assembly and shielding tasks.

This tape is used in electronic manufacturing, electronic assembly, and repair environments where XYZ-axis conductivity is required. The XYZ-axis conductive design allows electrical current to pass through the tape in all three dimensions, making it effective for grounding, shielding, and interconnect applications across PCB assemblies, chassis, and enclosures. It is typically installed by electronics assembly technicians, EMC engineers, and experienced field technicians working on electronic equipment requiring EMI and RFI management.

Key Features

• XYZ-axis electrical conductivity for three-dimensional current flow
• Pressure-sensitive acrylic adhesive with high HSE and low LSE surface compatibility
• 3.0 mil tape thickness with 4.0 mil polycoated kraft paper liner
• Medium temperature rating with high solvent resistance
• Sized for high-productivity roll application at 0.5 inches wide by 36 yards per roll
• Suitable for EMI and RFI shielding in demanding electronic environments

Compatibility

Designed for use in electronic shielding, grounding, and interconnect applications where XYZ-axis conductivity is required across high and low surface energy substrates.

Installation Notes

Installation is performed by electronics assembly technicians or EMC engineers. Power down and de-energize all equipment before applying conductive tape to chassis, PCB assemblies, or enclosures. Ensure the substrate surface is clean and free of oils, dust, and contaminants before application to achieve proper adhesive bond. Apply firm, even pressure across the full tape surface to ensure consistent electrical contact.