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The 3M 7010373830 is a pressure-sensitive adhesive (PSA) transfer tape engineered for Z-axis electrical conductivity, sold under the 3M Tape 9703 product line. It conducts electricity through the adhesive thickness but not laterally across the tape plane, making it purpose-built for grounded EMI and RFI shielding attachment and for interconnecting silver ink and polyester-based flexible circuits. The tape consists of a permanently tacky PSA matrix loaded with aligned conductive particles. It delivers stable electrical performance at moderately high temperatures and bonds reliably to a broad range of metallic and non-metallic substrates. Licensed electricians and electronics assembly technicians are the primary installers of this product.
This tape is used in residential, commercial, and industrial electronics applications where a reliable, repositionable electrical bond is required without thermal bonding processes. It is well suited for attaching EMI and RFI shielding layers, bonding flexible circuit assemblies, and making electrical interconnections on polyimide and polyester flex circuit materials, FR-4 board, copper, steel, and aluminum surfaces. The roll format makes it practical for both bench assembly work and field service applications where precision placement is needed.
Designed for use with silver ink and polyester-based flexible circuits, FR-4 PCB substrates, and common metallic surfaces including copper, steel, and aluminum, as well as polyimide and polyester flex circuit materials for EMI and RFI shielding attachment and interconnection applications.
This tape is typically applied by electronics technicians or licensed electricians working on shielding and flex circuit assemblies. Before application, clean all bonding surfaces to remove oils, dust, and contaminants that can reduce adhesion and increase contact resistance. Apply firm, even hand pressure across the full bonded area to ensure consistent conductivity through the Z-axis. The repositionable nature of the adhesive allows adjustment before final seating, but avoid repeated repositioning as this can degrade long-term bond strength.
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