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The 3M 7010373629 is a thermally conductive adhesive transfer tape designed to bond heat-generating components to heat dissipation surfaces in electronic and thermal management assemblies. The tape is 5.0 mil thick and is supplied on a 2.0 mil polyester liner, yielding a clean, repositionable transfer application process. It delivers both a reliable mechanical bond and a thermally conductive interface in a single step, eliminating the need for separate thermal compounds or mechanical fasteners. Licensed electricians, electronics technicians, and HVAC controls specialists install this product in assemblies where maintaining a low thermal resistance path between components is critical to system performance.
This tape is intended for use in thermal management applications across residential and commercial electronics and HVAC control assemblies. Documented applications include mounting thermoelectric cooling modules, bonding flexible circuits to heat sinks, bonding heat sinks to microprocessors, and bonding TAB-mounted integrated circuits to PCBs. It ships in roll form and is suited for both bench-assembly work and field retrofits where a precise, consistent bond line thickness is required.
Designed for use in thermal interface applications including thermoelectric cooling module mounting, flexible circuit-to-heat-sink bonding, heat sink-to-microprocessor bonding, and TAB-mounted IC to PCB bonding.
Installation is typically performed by electronics technicians or HVAC controls specialists during board-level or module-level assembly. Surfaces should be clean, dry, and free of oils or contaminants before applying the tape to ensure full adhesion and thermal contact. Power down and de-energize any assembly before handling internal components or applying thermal interface materials. Avoid stretching or folding the tape during liner removal, as deformation can affect bond line consistency and thermal performance.
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