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The 3M 7010373368 is an XYZ-axis electrically conductive pressure-sensitive tape designed for EMI and RFI shielding in demanding electronic assemblies. The adhesive system is a pressure-sensitive acrylic that delivers conductivity across all three axes — X, Y, and Z — making it suitable for grounding, bonding, and shielding applications where consistent electrical contact is required. The tape measures 3 mil thick with a 4 mil polycoated kraft paper liner and comes in a 4.5-inch by 36-yard roll. It is engineered for medium temperature service and high solvent resistance, and performs across both high surface energy (HSE) and low surface energy (LSE) substrates.
This tape is used in electronics manufacturing, PCB assembly, and electrical enclosure fabrication where EMI and RFI shielding is required. It suits applications involving shielding gaskets, connector bonding, and grounding straps on electronic components and assemblies. The pressure-sensitive system allows for fast application without curing time, supporting high-throughput production environments. Technicians and assembly professionals working in electronics, defense electronics, and industrial controls will find this tape appropriate for shielding continuity paths and grounding bonds.
Designed as an OEM-style conductive tape for EMI and RFI shielding applications in electronic assemblies requiring XYZ-axis conductivity across HSE and LSE substrate surfaces.
Installation is performed by electronics assembly technicians or electricians working on shielded enclosures. Power down and de-energize all circuits before applying conductive tape to live assemblies or grounding points. Ensure the bonding surface is clean, dry, and free of oils or contaminants before application to achieve proper adhesion and electrical contact. Follow applicable IPC or facility-specific assembly standards for shielding and grounding tape placement.
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