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The 3M 7010372869 is a low static polyimide film tape designed for demanding electronics manufacturing and high-temperature fabrication applications. The tape carries the 3M 5419 Gold designation and features a polyimide film backing with a silicone adhesive system. At 2.7 mil total thickness, it delivers a thin, conformable profile while maintaining dimensional stability under elevated process temperatures. Its defining characteristic is an extremely low electrostatic discharge (ESD) profile, which makes it suitable for use directly on or near sensitive electronic assemblies. The roll measures 0.25 inches wide by 36 yards long.
This tape is used primarily in electronics assembly environments. It functions as a masking tape for printed circuit boards (PCBs) during wave solder or solder dip processes, protecting areas that must remain solder-free. It also serves as a release surface in the fabrication of parts that undergo curing at elevated temperatures. Typical end users include PCB assembly technicians, electronics manufacturing engineers, and composite fabrication specialists working in both production and prototyping settings.
Designed for use as a masking tape on printed circuit boards during wave solder or solder dip processes, and as a release surface in elevated-temperature part fabrication applications.
Application should be performed by qualified electronics assembly or fabrication technicians following applicable ESD handling protocols. Ensure the substrate surface is clean and dry before applying the tape to achieve full adhesive contact. Remove the tape promptly after the process cycle, following the adhesive manufacturer guidance for peel temperature and angle to avoid residue. Store unused rolls in original packaging away from direct sunlight and excessive humidity.
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