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The 3M 7010333947 is a pressure-sensitive adhesive transfer tape loaded with thermally conductive ceramic fillers, designed to create a reliable heat-transfer path between heat-generating components and cooling devices such as heat sinks, fans, heat spreaders, and heat pipes. No heat cure cycle is required — bond formation occurs with pressure alone, making installation straightforward in production and field-service environments. The tape is modestly soft, allowing it to conform to non-flat substrates while maintaining high adhesion. It also provides good electrical insulation alongside its thermal conductivity, making it suitable for sensitive electronic assemblies.
This tape is used in applications where efficient thermal management is critical, including bonding heat-generating electronic components to heat sinks or other thermal dissipation devices. Its ability to wet and flow onto a wide variety of substrate surfaces makes it adaptable across residential, commercial, and industrial electronics assembly and repair scenarios. Technicians working in HVAC controls, electronics manufacturing, and power electronics service will find this tape useful for interface applications requiring both thermal conductivity and electrical insulation without additional cure steps.
Designed as a thermally conductive adhesive interface tape suitable for bonding heat-generating electronic components to heat sinks, heat spreaders, heat pipes, fans, and similar cooling devices across a wide range of substrate types.
Installation is performed by pressing the tape firmly between the mating surfaces — no heat activation or adhesive cure cycle is required. Power down and discharge any electrical components before applying the tape to heat-generating assemblies. Cut to the required length from the roll using a clean straight-edge cutter to avoid contaminating the adhesive surface. Ensure both substrate surfaces are clean and free of oils, dust, or other contaminants before application to achieve full adhesion and thermal contact.
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