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The 3M 7010311896 is a thermally conductive adhesive transfer tape designed to bond heat-dissipating components in electronic and thermal management assemblies. The tape measures 0.75 inches wide by 36 yards long and carries a total thickness of 5.0 mil, consisting of a thermally conductive adhesive layer on a 2.0 mil polyester liner. It provides a thin, conformable bond line that transfers heat efficiently between mating surfaces. HVAC technicians, electronics assemblers, and thermal management specialists use this tape where a reliable, low-profile thermal interface is required without mechanical fasteners or separate thermal compounds.
This tape is suited for applications where heat must be conducted away from sensitive components or modules. Primary uses include mounting thermoelectric cooling modules, bonding flexible circuits to heat sinks, attaching heat sinks to microprocessors, and bonding TAB-mounted integrated circuits to printed circuit boards. The roll format is practical for production environments and field service work where consistent, repeatable application is needed across multiple units or assemblies.
Designed for use in thermal management assemblies including thermoelectric cooling module mounting, flexible circuit-to-heat-sink bonding, heat sink-to-microprocessor bonding, and TAB-mounted IC-to-PCB bonding applications.
Power down and fully de-energize any assembly before applying this tape to electronic components or thermal interfaces. Clean and dry all mating surfaces prior to application to ensure full adhesive contact. Apply firm, even pressure across the tape surface after placement to achieve proper bond strength. Installation should be performed by qualified technicians familiar with thermal interface materials and applicable assembly standards.
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