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The 3M 7000125230 is a low static polyimide film tape designed for high-temperature masking and release surface applications in electronics manufacturing and fabrication environments. The tape features a polyimide film backing with a silicone adhesive system and is engineered with extremely low electrostatic discharge properties, making it suitable for use on and around sensitive electronic components. At 2.7 mil total thickness, the tape offers a thin but durable profile. It ships on a plastic core in a 0.5-inch-wide by 36-yard roll. This product is handled by electronics assembly technicians, PCB fabricators, and composites manufacturing professionals.
This tape is used as a masking solution for printed circuit boards during wave solder and solder dip processes, where protection of components and precise masking edges are required. It also serves as a release surface in the fabrication of parts cured at elevated temperatures, a common requirement in aerospace, electronics, and industrial composite layup operations. The low static characteristic makes it appropriate where electrostatic discharge could damage components or affect process quality.
Designed for use in printed circuit board masking during wave solder and solder dip processes, and as a release surface in elevated-temperature part fabrication environments.
Application is typically performed by electronics assembly or fabrication technicians familiar with masking tape placement on PCBs or mold surfaces. Ensure the substrate surface is clean and free of contamination before applying the tape to achieve proper adhesion and masking performance. When used in high-temperature cure cycles, verify that process temperatures are within the rated range of polyimide film silicone adhesive tapes before committing to a production run. Remove the tape carefully after the process to avoid residue transfer or damage to finished surfaces.
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