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The 3M 7000123673 is a low static polyimide film tape rated at 2.7 mil thickness, backed with a silicone adhesive and engineered for applications where electrostatic discharge must be kept extremely low. The tape features a translucent gold polyimide film that resists high temperatures, making it suitable for masking, holding, and surface protection in demanding electronics and fabrication environments. It ships in roll form and is handled by electronics assembly technicians, PCB fabricators, and industrial manufacturing personnel.
This tape is designed for masking printed circuit boards during wave solder and solder dip processes, where it must withstand elevated process temperatures without adhesive bleed or lifting. It also serves as a release surface in the fabrication of composite or cured parts that require elevated-temperature cure cycles. The low electrostatic discharge characteristic makes it well suited for sensitive electronic assembly lines where static control is critical to component integrity.
Designed for use in printed circuit board masking during wave solder and solder dip processes, and as a release surface in elevated-temperature part fabrication and cure applications.
Application should be performed by qualified electronics assembly or fabrication technicians familiar with static-sensitive work environments. Ensure the substrate surface is clean and dry before applying the tape to achieve full adhesive contact. When using as a PCB mask, apply firm, even pressure along the tape edge to prevent solder intrusion. Follow all facility ESD protocols and process temperature guidelines for the specific solder or cure operation being performed.
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