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The 3M 7000050146 is a low static polyimide film tape designed for high-temperature masking and release applications in electronics manufacturing and industrial fabrication. The tape features a translucent gold polyimide film backing coated with a silicone adhesive and is engineered for extremely low electrostatic discharge (ESD) properties. At 2.7 mil total thickness, it delivers reliable conformability and adhesion under elevated thermal conditions. This product is handled by electronics assembly technicians, PCB fabricators, and industrial process engineers working in environments where static control and heat resistance are critical requirements.
This tape is used primarily as a masking solution for printed circuit boards (PCBs) during wave solder or solder dip processes, where protection of components and traces from solder contact is required. It also serves as a release surface in the fabrication of composite or molded parts that are cured at elevated temperatures. The combination of low static generation and thermal stability makes it suitable for both electronics production lines and high-temperature industrial cure cycles. Each roll measures 22.5 inches wide by 36 yards long, making it appropriate for wide-format masking applications.
Designed for use in wave solder and solder dip masking applications on printed circuit boards and as a release surface in elevated-temperature composite or part fabrication processes.
Application should be performed by qualified electronics assembly technicians or industrial process personnel familiar with static-sensitive handling procedures. Surfaces should be clean and dry before tape application to ensure proper adhesion. When used in soldering processes, verify that process temperatures do not exceed the thermal limits of the tape assembly. Remove tape carefully after processing to avoid residue transfer or damage to underlying components or surfaces.
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