3M 7000050110 Polyimide Film Tape 5419 0.5in X 36yd

Product Description

The 3M 7000050110 is a low static polyimide film tape — sold as 3M Tape 5419 — designed for high-temperature masking and release applications in electronics manufacturing. This roll measures 0.5 inches wide by 36 yards long at a 2.7 mil total thickness and is built on a paper core. The backing is a translucent polyimide film coated with a silicone adhesive that delivers exceptionally low electrostatic discharge (ESD) properties. Its combination of heat resistance, dimensional stability, and low static generation makes it a go-to for PCB masking and elevated-temperature fabrication work.

3M Tape 5419 is used primarily in electronics assembly and fabrication environments. Its core application is masking printed circuit boards during wave solder and solder dip processes, where the tape must survive elevated process temperatures without adhesive transfer or board contamination. It also functions as a release surface when fabricating parts cured at high temperatures. Typical installers and users include electronics assembly technicians, PCB fabricators, and production line operators working with SMT and through-hole soldering equipment.

Key Features

• Extremely low electrostatic discharge properties — suitable for static-sensitive PCB environments
• Translucent polyimide film backing with silicone adhesive for clean removal after high-temperature exposure
• 2.7 mil total tape thickness for reliable masking coverage without bulk
• 0.5-inch width on a 36-yard paper core roll — practical for precision masking runs
• Rated for use during wave solder and solder dip processes
• Doubles as a release surface for parts cured at elevated temperatures in fabrication applications

Compatibility

Designed as an OEM-style masking tape for use in wave solder, solder dip, and elevated-temperature part fabrication processes on printed circuit boards.

Installation Notes

Apply to clean, dry PCB surfaces before wave solder or solder dip operations to protect pads, connectors, or areas not intended to receive solder. Remove the tape promptly after the process while the board is still warm to minimize adhesive residue risk. No special tools are required for application, but care should be taken to press edges firmly to prevent solder wicking beneath the tape. Consult applicable IPC standards and your facility safety protocols when working with soldering equipment and flux chemistry.