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The 3M 7000050110 is a low static polyimide film tape — sold as 3M Tape 5419 — designed for high-temperature masking and release applications in electronics manufacturing. This roll measures 0.5 inches wide by 36 yards long at a 2.7 mil total thickness and is built on a paper core. The backing is a translucent polyimide film coated with a silicone adhesive that delivers exceptionally low electrostatic discharge (ESD) properties. Its combination of heat resistance, dimensional stability, and low static generation makes it a go-to for PCB masking and elevated-temperature fabrication work.
3M Tape 5419 is used primarily in electronics assembly and fabrication environments. Its core application is masking printed circuit boards during wave solder and solder dip processes, where the tape must survive elevated process temperatures without adhesive transfer or board contamination. It also functions as a release surface when fabricating parts cured at high temperatures. Typical installers and users include electronics assembly technicians, PCB fabricators, and production line operators working with SMT and through-hole soldering equipment.
Designed as an OEM-style masking tape for use in wave solder, solder dip, and elevated-temperature part fabrication processes on printed circuit boards.
Apply to clean, dry PCB surfaces before wave solder or solder dip operations to protect pads, connectors, or areas not intended to receive solder. Remove the tape promptly after the process while the board is still warm to minimize adhesive residue risk. No special tools are required for application, but care should be taken to press edges firmly to prevent solder wicking beneath the tape. Consult applicable IPC standards and your facility safety protocols when working with soldering equipment and flux chemistry.
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