3M 7000050065 Polyimide Film Tape 5413 Amber 3/8in X 36yd

Product Description

The 3M 7000050065 is a polyimide film tape in the 3M 5413 series, amber in color, measuring 3/8 inches wide by 36 yards long with a total thickness of 2.7 mil. The tape combines a polyimide film backing with a silicone adhesive system, making it flame retardant and resistant to both chemical exposure and radiation. This construction allows it to perform reliably at elevated process temperatures where standard film tapes would fail. It is primarily used by electronics technicians, PCB fabricators, and manufacturing process engineers working in high-temperature masking and protection applications.

This tape is suited for professional electronics manufacturing and fabrication environments. Common applications include masking gold fingers on printed circuit boards during wave solder or solder dip operations, where precise, clean adhesion and clean removal are critical. It also serves as a release surface in the fabrication of parts that are cured at elevated temperatures in ovens or autoclaves. The amber film allows visual confirmation of placement during masking workflows.

Key Features

• 2.7 mil polyimide film backing with silicone adhesive for high-temperature performance
• Flame retardant construction suitable for solder process environments
• Chemical and radiation resistant for demanding fabrication conditions
• Performs as a masking tape for PCB gold finger protection during wave solder and solder dip
• Functions as a release surface for parts cured at elevated temperatures
• Amber color provides visual confirmation of tape placement during masking

Compatibility

Designed for use in printed circuit board masking during wave solder and solder dip processes, and as a release surface in elevated-temperature part fabrication workflows.

Installation Notes

Application is typically performed by electronics assembly technicians or PCB fabrication personnel. Ensure the substrate surface is clean and free of oils or residue before applying tape to achieve proper adhesion and clean removal. Follow facility safety protocols when working near solder baths or elevated-temperature curing equipment. Remove tape carefully after the process cycle to avoid substrate damage.