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The 3M 7000048868 is an XYZ-axis electrically conductive pressure-sensitive tape designed for EMI and RFI shielding applications in demanding electronic assemblies. It uses an acrylic adhesive system that bonds to both high surface energy (HSE) and low surface energy (LSE) substrates, making it adaptable across a wide range of electronic component surfaces. The tape measures 3.0 mil thick with a 4.0 mil polycoated kraft paper liner and comes in a 12-inch-wide by 108-yard roll. Rated for medium temperature service with high solvent resistance, it is suited for electronics manufacturing environments where shielding integrity and process reliability are critical. Electronics assembly technicians and field service engineers are the primary installers.
This tape is used in printed circuit board assemblies, electronic enclosures, flex circuit shielding, and device grounding applications where conductivity is required across all three axes — X, Y, and Z. Its high-productivity roll format supports both hand application and automated dispensing in production settings. The combination of HSE and LSE surface compatibility makes it useful when assembling dissimilar materials within a single electronic device or chassis. It is appropriate for both prototype builds and volume production runs in the electronics and defense electronics sectors.
Designed as an OEM-style conductive shielding tape for use in electronic assemblies requiring multi-axis electrical conductivity and EMI or RFI attenuation across HSE and LSE substrate combinations.
Application is performed by electronics assembly technicians or field service personnel. Surfaces should be clean, dry, and free of oils or particulates before tape is applied to ensure full adhesive contact and consistent conductivity. Power down and discharge any components in the assembly before applying conductive tape in live circuit areas. Avoid stretching the tape during application, as deformation may affect dimensional consistency and contact resistance.
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