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The 3M 7000048693 is a low static polyimide film tape designed for demanding thermal and electronic manufacturing applications. The tape features a translucent gold polyimide film backing with a silicone adhesive system and measures 2.7 mil (0.07 mm) in total thickness. Its defining characteristic is an extremely low electrostatic discharge (ESD) profile, which makes it suitable for use in environments where static generation must be minimized. Technicians working in PCB assembly, electronics fabrication, and high-temperature part manufacturing rely on this tape for consistent performance across repeated thermal cycles.
This tape is used primarily in printed circuit board masking during wave solder and solder dip processes, where it must withstand elevated process temperatures while protecting designated board areas. It also serves as a release surface in the fabrication of composite or molded parts that cure at high temperatures. The combination of the polyimide film substrate and silicone adhesive makes it well suited for applications where conventional pressure-sensitive tapes would fail under heat exposure. Electronics assemblers, PCB technicians, and industrial fabricators are the primary users.
Designed for use as a masking tape on printed circuit boards during wave solder and solder dip processes, and as a release surface in fabrication applications involving elevated-temperature curing cycles.
Application should be performed by qualified electronics assembly technicians or industrial fabricators familiar with PCB masking and high-temperature tape processes. Surfaces should be clean, dry, and free of contaminants before tape is applied to ensure proper adhesion and clean removal. Follow applicable IPC assembly standards and facility ESD control protocols when working in static-sensitive environments. Remove tape carefully after processing to avoid residue transfer on sensitive substrates.
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