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The 3M 7000048687 is a polyimide film tape with a silicone adhesive backing, offered in an amber finish at 2.7 mil total thickness. The film construction is flame retardant and resistant to chemicals and radiation, making it well suited for demanding thermal and process environments. Each roll measures 12 inches wide by 36 yards long and weighs 3 pounds. This tape is primarily used in electronics manufacturing and precision fabrication operations where reliable masking and surface protection are required at elevated temperatures. Installation is handled by electronics assembly technicians and fabrication specialists.
This tape is a standard choice for masking the gold fingers of printed circuit boards during wave solder or solder dip processes, preventing solder contamination on contact surfaces. It also functions as a release surface in fabrication workflows where parts are cured at elevated temperatures. The silicone adhesive is selected specifically for its ability to remain stable and cleanly removable after high-temperature exposure, which is critical in both PCB protection and composite or specialty part production environments.
Designed for use in wave solder and solder dip masking of printed circuit board gold fingers, and as a release surface in fabrication processes involving elevated-temperature curing cycles.
Application is typically performed by electronics assembly technicians or fabrication specialists following established process documentation. Ensure the substrate surface is clean and dry before applying the tape to achieve full adhesion. Remove the tape promptly after the solder or cure process while the part is still warm, if process guidelines allow, to minimize adhesive residue. Follow all applicable facility safety procedures when working near soldering equipment or elevated-temperature cure ovens.
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