3M 7000048445 Circuit Plating Tape 1280 Red 2in X 72yd

Product Description

The 3M 7000048445 is a red polyester film masking tape engineered for printed circuit board electroplating operations. The 4.2 mil film construction uses a silicone and rubber blend adhesive that holds securely against plating bath chemistries while allowing clean removal without residue. Each roll measures 2 inches wide by 72 yards long, providing substantial coverage per roll for production-volume masking work. Electronics assembly technicians and PCB fabricators apply this tape to mask off areas of a board that must be kept free of plated metal deposits during selective electroplating processes.

This tape is suited for PCB masking in both prototype and production environments where precise, repeatable coverage is required. The red film provides clear visual contrast against green or bare board substrates, making it easy to inspect coverage before boards enter the plating line. Its polyester backing resists stretching during application, which helps maintain dimensional accuracy along masked edges.

Key Features

• 4.2 mil polyester film backing resists tearing and stretching during application
• Silicone and rubber blend adhesive withstands electroplating bath exposure
• Red film provides high visual contrast for pre-plating inspection
• 2 inches x 72 yards per roll supports high-volume masking runs
• Designed for clean removal after plating without adhesive transfer

Compatibility

Designed as an OEM-specification masking tape for printed circuit board electroplating applications where a conformable polyester film tape with plating-bath-resistant adhesive is required.

Installation Notes

Application is performed by electronics assembly technicians or PCB process technicians as part of pre-plating board preparation. Ensure board surfaces are clean and free of oils or flux residue before applying tape to promote consistent adhesion. Apply firm, even pressure along the tape edge to prevent plating solution from wicking beneath the masked border. Remove tape promptly after plating and before any post-process baking steps unless the process specification confirms tape compatibility at elevated temperatures.