3M 7000046439 Epoxy Potting Compound Part B 5 Gallon

Product Description

The 3M 7000046439 is the Base (Part B) component of the Scotch-Weld Epoxy Potting Compound 270, a rigid two-part epoxy formulated for potting and bonding electronic and electrical components. This low-viscosity compound offers a 1:1 mix ratio with a 70-minute work life, allowing adequate time for dispensing and positioning before cure. Handling strength is achieved in approximately 3 hours. The formula is non-corrosive to copper and non-exotherming, making it well suited for heat-sensitive assemblies. This 5-gallon container supplies the B side of the B/A system and must be paired with the corresponding Part A to achieve a complete, cured compound.

Epoxy Potting Compound 270 Part B is used in residential and commercial electrical and electronics assembly applications where reliable encapsulation of components is required. Typical installations include potting circuit boards, sensors, coils, and similar components where protection from moisture, vibration, and mechanical stress is needed. Its high-flow characteristic allows the compound to fill irregular cavities and voids around components without manual manipulation. Electronics assemblers, electrical contractors, and OEM production technicians are the primary users of this product.

Key Features

• 1:1 mix ratio simplifies dispensing with standard two-component equipment
• 70-minute work life provides extended open time for complex potting operations
• Handling strength reached in approximately 3 hours after mixing
• Low viscosity and high flow fill cavities around electronic components without voids
• Non-corrosive to copper — safe for use directly around copper conductors and coils
• Non-exotherming formulation reduces thermal risk to heat-sensitive components during cure

Compatibility

This product is the Base (Part B) component designed for use in the 3M Scotch-Weld Epoxy Potting Compound 270 B/A two-part system. It must be combined with the corresponding Part A at a 1:1 ratio to produce a cured compound suitable for potting and bonding electronic and electrical components.

Installation Notes

This compound is handled by electronics assembly technicians and electrical professionals working with encapsulation equipment. De-energize all circuits and discharge any stored energy in components before beginning potting operations. Use appropriate two-component dispensing equipment calibrated to a 1:1 ratio to ensure proper cure. Follow applicable safety data sheet guidance for ventilation, skin protection, and waste disposal when handling uncured epoxy materials.

Technical Specifications

• Mix Ratio: 1:1 (B/A by volume)
• Work Life: 70 minutes
• Handling Strength Time: Approximately 3 hours
• Viscosity: Low
• Component: Part B (Base)
• Container Size: 5 Gallon
• Weight: 10.59 pounds
• UPC: 00021200822643

Standard Information

• Brand: 3M
• Manufacturer Part Number: 7000046439