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The 3M 7000001216 is a polyimide film tape rated at 2.7 mil (0.07 mm) thick, backed with a silicone adhesive system and supplied in an amber-colored roll measuring 24 inches wide by 36 yards long. The polyimide film construction delivers high-temperature resistance, making it suitable for masking and protection tasks where standard tapes fail. The silicone adhesive bonds reliably to circuit board surfaces and release substrates without leaving problematic residue after removal. This tape is flame retardant and resists a broad range of chemicals and radiation exposure, which keeps it effective through aggressive manufacturing and soldering processes.
This tape is primarily used in electronics manufacturing and PCB fabrication environments. It serves as a protective mask over gold fingers on printed circuit boards during wave solder and solder dip operations, shielding contact pads from solder contamination. It also functions as a release surface in the fabrication of composite parts and components cured at elevated temperatures. Electronics assembly technicians and composite fabrication workers are the primary installers and users of this product.
Designed for use as a masking tape for gold finger protection on printed circuit boards during wave solder and solder dip processes, and as a release surface for composite parts cured at elevated temperatures.
Application should be performed by trained electronics assembly or composite fabrication technicians following established ESD and process protocols. Ensure the substrate surface is clean, dry, and free of oils or contaminants before applying tape to achieve full adhesive contact. When used in wave solder masking, confirm tape edges are fully adhered to prevent solder wicking under the mask. Remove tape promptly after the process step is complete and the assembly has cooled to a safe handling temperature.
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