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The 3M 7000001213 is a low static polyimide film tape designed for high-temperature masking and surface release applications in electronics manufacturing and industrial fabrication. The tape features a translucent gold polyimide film backing coated with a silicone adhesive and measures 2.7 mil thick. Its most critical characteristic is extremely low electrostatic discharge (ESD) behavior, which protects sensitive electronic components during processing. Licensed electricians, electronics assemblers, and PCB fabrication technicians are the primary installers and users of this tape in production environments.
This tape is used primarily as a masking solution for printed circuit boards during wave solder and solder dip processes, where it must withstand elevated process temperatures without lifting, residue transfer, or ESD events. It is also used as a release surface in the fabrication of composite or molded parts cured at elevated temperatures. Applications span both light industrial and precision electronics manufacturing settings, making it a dual-purpose process tape for production facilities handling heat-cure and soldering operations.
Designed for use in printed circuit board wave solder and solder dip masking processes, as well as elevated-temperature composite and part fabrication applications requiring a low-static release surface.
Application should be performed by qualified electronics assembly or fabrication technicians following applicable ESD control protocols and facility process standards. Ensure surfaces are clean and dry before tape application to achieve full adhesive contact. Remove tape promptly after the process cycle is complete, following the material manufacturer's guidance on removal temperature and peel angle to minimize residue risk. Handle in ESD-controlled environments to preserve the tape's low-static performance characteristics prior to use.
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